Product properties

Samsung RP5260 Core board

SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY CO.,LTD.

Contact information: 0755-235747363

Address: 3rd Floor, Block A, Phase II, Huafeng International Robot Industrial Park, Xixiang Street, Baoan District, Shenzhen (Gushu Metro Exit C)

Product description

⒉MAIN HARDWARE INDICATORS

SIZE	60*55mm
HEIGHT	3mm
TECHNOLOGY	8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design
CPU	Samsung Exynos5260，Based on 2 Cortex-A15 + 4 Cortex-A7，Operating Main Frequency 200MHz~1700MHz
GPU	Mali-600 MP
MEMORY	2GB DDR3 Dual-channel 32-bit bus
STORAGE	16GB EMMC4.5（Batch customizable 4/8GB）
PMU	Samsung customized original distribution power management chip S2MPA01
WORKING VOLTAGE	5V（Recommended use of standard 5V/3A power cord）
PIN EXPANSION	Lead-out foot up to 184PIN, to meet the user's various practical expansion needs
OPERATING TEMPERATURE	Form -10℃ to 75℃
SUPPORT SYSTEM	Android4.4.2

⒊PRODUCT PICTURES

（Positive）

⒋PCB DIMENSION MAP

（Positive）

⒉MAIN HARDWARE INDICATORS

SIZE	60*55mm
HEIGHT	3mm
TECHNOLOGY	8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design
CPU	Samsung Exynos5260，Based on 2 Cortex-A15 + 4 Cortex-A7，Operating Main Frequency 200MHz~1700MHz
GPU	Mali-600 MP
MEMORY	2GB DDR3 Dual-channel 32-bit bus
STORAGE	16GB EMMC4.5（Batch customizable 4/8GB）
PMU	Samsung customized original distribution power management chip S2MPA01
WORKING VOLTAGE	5V（Recommended use of standard 5V/3A power cord）
PIN EXPANSION	Lead-out foot up to 184PIN, to meet the user's various practical expansion needs
OPERATING TEMPERATURE	Form -10℃ to 75℃
SUPPORT SYSTEM	Android4.4.2

⒊PRODUCT PICTURES

（Positive）

⒋PCB DIMENSION MAP

（Positive）